基本信息
出版地:UNITED STATES
期刊简称:IEEE T COMP PACK MAN
通讯地址:445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
创刊年份:2011
发行周期:12 issues/year
涉及方向:ENGINEERING, MANUFACTURING - ENGINEERING, ELECTRICAL & ELECTRONIC
ESSN:2156-3985
英文期刊简介
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
中文期刊简介
《Ieee Transactions On Components Packaging And Manufacturing Technology》是一本由Institute of Electrical and Electronics Engineers Inc.出版商出版的专业工程技术期刊，该刊创刊于2011年，刊期12 issues/year，该刊已被国际权威数据库SCI、SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 3区，小类学科：工程：电子与电气 3区；材料科学：综合 3区；工程：制造 4区；在JCR（Journal Citation Reports）分区等级为Q3。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.922，平均审稿速度一般,3-6周。
