基本信息
出版地:UNITED STATES
期刊简称:J ELECTRON PACKAGING
通讯地址:ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990
创刊年份:1989
发行周期:Quarterly
涉及方向:工程技术 - 工程：电子与电气
ESSN:1528-9044
英文期刊简介
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
中文期刊简介
《Journal Of Electronic Packaging》是一本由ASME出版商出版的专业工程技术期刊，该刊创刊于1989年，刊期Quarterly，该刊已被国际权威数据库SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 4区，小类学科：工程：电子与电气 4区；工程：机械 4区；在JCR（Journal Citation Reports）分区等级为Q3。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.931，平均审稿速度>12周，或约稿。
